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Multichip modules
Title Multichip modules : systems advantages, major constructions, and materials technologies Another authors Johnson W.R. (Editor) Teng R.K.F. (Editor) Balde J.W. (Editor) Issue data New York : IEEE Press , 1991. - 603 s. Edition IEEE Press selected reprint series Language eng - English Country US - United States of America ISBN 0-87942-267-X Catal.org. SAVELEK Copy count 1, currently available 0, at library only 1 Document kind zborníky book
Call number Location Sublocation Info 9969 Elektrotechnický ústav SAV 309 In-Library Use Only
Number of the records: 1