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Inducible overexpression of gB gene of HSV-1 in T-Rex cell line
Title Nanocomposite SAC solders: morphology, electrical and mechanical properties of Sn-3.8Ag-0.7Cu solders by adding Co nanoparticles Author Yakymovych A. Švec Peter 1955 SAVFYZIK - Fyzikálny ústav SAV ORCID Janičkovič Dušan 1957 SAVFYZIK - Fyzikálny ústav SAV Šebo Pavol 1939- SAVMAMES - Ústav materiálov a mechaniky strojov SAV SCOPUS Beronská Naďa 1980 - SAVMAMES - Ústav materiálov a mechaniky strojov SAV SCOPUS Nosko Martin SAVMAMES - Ústav materiálov a mechaniky strojov SAV SCOPUS ORCID Orovčík Ľubomír SAVMAMES - Ústav materiálov a mechaniky strojov SAV SCOPUS RID ORCID Co-authors Plevachuk Yu. Roshanghias A. Ipser H. Source document Journal of Materials Science. Materials in Electronics. Vol. 28, no. 15 (2017), p. 10965-10973 Language eng - English Country NL - Netherlands URL URL link Document kind rozpis článkov z periodík (rbx) Citations GUO, Bingfeng - JIANG, Chengrong - KUNWAR, Anil - ZHAO, Ning - CHEN, Jun - WANG, Yunpeng - MA, Haitao. Effect of Ag concentration on the Cu6Sn5 growth in Sn-based solder/Cu joints at the isothermal reflow stage. In 2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017, vol., no., pp. 1087-1091. YAO, Jinye - LI, Hua - HUANG, Ru - QI, Xiao - WANG, Boyin - QIAO, Junshan - WANG, Yunpeng - MA, Haitao. Mechanism of Cu5Zn8 layer act as a diffusion barrier layer. In 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018, vol., no., pp. 383-386. GUO, Bingfeng - KUNWAR, Anil - JIANG, Chengrong - ZHAO, Ning - SUN, Junhao - CHEN, Jun - WANG, Yunpeng - HUANG, Mingliang - MA, Haitao. Synchrotron radiation imaging study on the rapid IMC growth of Sn-xAg solders with Cu and Ni substrates during the heat preservation stage. In JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS. ISSN 0957-4522, 2018, vol. 29, no. 1, pp. 589-601. DOGAN, Ali - ARSLAN, Huseyin. Thermodynamic description of the viscosity of liquid solder alloys with minor Co impurities. In PHILOSOPHICAL MAGAZINE. ISSN 1478-6435, 2019, vol. 99, no. 3, pp. 267-283. SITTA, Alessandro - RUSSO, Sebasliano - TORRISI, Marco - MESSINA, Angelo Alberto - D'ARRIGO, Giuseppe - SEQUENZIA, Gaetano - RENNA, Marco - CALABRETTA, Michele. An integrated approach to optimize solder joint reliability. In 2020 21ST INTERNATIONAL CONFERENCE ON THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS (EUROSIME), 2020. AFDZALUDDIN, Atiqah Mohd - ABU BAKAR, Maria. Effect of Coating Element on Joining Stability of Sn-0.3Ag-0.7Cu Solder Joint due to Aging Test. In SAINS MALAYSIANA. ISSN 0126-6039, 2020, vol. 49, no. 12, pp. 3029-3036. ZHAO, Meng - ZHANG, Liang - SUN, Lei - XIONG, Ming-yue - JIANG, Nan - XU, Kai-kai. Effects of nanoparticles on properties and interface reaction of Sn solder for microelectronic packaging. In INTERNATIONAL JOURNAL OF MODERN PHYSICS B. ISSN 0217-9792, 2020, vol. 34, no. 8, 2050064. SHALABY, Rizk Mostafa - ELZANATY, Hesham. Effect of nano-Al2O3 particles on the microstructure and mechanical performance of melt-spun process Sn-3.5Ag composite solder. In JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS. ISSN 0957-4522, 2020, vol. 31, no. 8, pp. 5907-5913. SHANG, Min - DONG, Chong - MA, Haoran - WANG, Yunpeng - MA, Haitao. Simulation for Cu Atom Diffusion Leading to Fluctuations in Solder Properties and Cu6Sn5 Growth during Multiple Reflows. In METALS, 2021, vol. 11, no. 12, 2041. Dostupné na: https://doi.org/10.3390/met11122041. GU, Xin - BAI, Hailong - CHEN, Dongdong - ZHAO, Lingyan - YI, Jianhong - LIU, Xiang - YAN, Jikang. The influences of reactive nanoparticles alloying on grain boundary and melting properties about Sn3.0Ag0.5Cu solder. In INTERMETALLICS. ISSN 0966-9795, 2021, vol. 138, 107346. Dostupné na: https://doi.org/10.1016/j.intermet.2021.107346. ISMAIL, Norliza - JALAR, Azman - AFDZALUDDIN, Atiqah - ABU BAKAR, Maria. Electrical resistivity of Sn-3.0Ag-0.5Cu solder joint with the incorporation of carbon nanotubes. In NANOMATERIALS AND NANOTECHNOLOGY. ISSN 1847-9804, 2021, vol. 11, 1847980421996539. Dostupné na: https://doi.org/10.1177/1847980421996539. PASSALACQUA, E. - LAPRAIS, C. - BYLUND, M. - LI, Q. - MARKNAS, V. - ANDERSSON, R. - SALEEM, Amin M. - DESMARIS, V. Flip chip interconnects based on carbon nanofibers-solder composites. In Proceedings Electronic Components and Technology Conference. ISSN 05695503, 2021-01-01, 2021-June, pp. 2229-2234. Dostupné na: https://doi.org/10.1109/ECTC32696.2021.00350. FAWAD, Muhammad - SADIQ, Muhammad - NAWAZ, Ahmad - ARIF, Muhammad - BIBI, Saira - ISLAM, Bilal - AHMAD, Shahid Nisar - NOOR, Sahar - HUSSAIN, Iftikhar. Effects of heat treatment on mechanical, electrical properties and curtailment of electromigration in Sn-Ag-3.0-Cu-0.5 soldering based alloys. In METALLURGICAL RESEARCH & TECHNOLOGY, 2022, vol. 119, no. 6. ISSN 2271-3646. Dostupné na: https://doi.org/10.1051/metal/2022084. AL-SORORY, Hamed - GUMAAN, Mohammed S. - SHALABY, Rizk Mostafa. ZnO nanoparticles and compositional dependence of structural, thermal, mechanical, and electrical properties for eutectic SAC355 lead-free solder alloys. In Results in Materials, 2022-09-01, 15, pp. Dostupné na: https://doi.org/10.1016/j.rinma.2022.100285. RAJENDRAN, Sri Harini - SEO, Seong Min - JUNG, Jae Pil. Effect of 0D and 1D ZnO nano additive reinforced Sn-3.0Ag-0.5Cu solder paste on InGaN LED chip/ENIG joints. In MATERIALS TODAY COMMUNICATIONS, 2023, vol. 35, no., pp. Dostupné na: https://doi.org/10.1016/j.mtcomm.2023.105795. Category ADCA - Scientific papers in foreign journals registered in Current Contents Connect with IF (impacted) Category of document (from 2022) V3 - Vedecký výstup publikačnej činnosti z časopisu Type of document článok Year 2017 Registered in WOS Registered in SCOPUS 
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rok vydania rok metriky IF IF Q (best) SJR SJR Q (best) 2004
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