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Effect of in Addition on Sn-Ag Solder, Wetting and Shear Strenght of Copper Joints
Title Effect of in Addition on Sn-Ag Solder, Wetting and Shear Strenght of Copper Joints Author Šebo Pavol 1939- SAVMAMES - Ústav materiálov a mechaniky strojov SAV SCOPUS Co-authors Štefánik Pavol 1952- SAVMAMES - Ústav materiálov a mechaniky strojov SAV SCOPUS Source document COST Action 531 : Lead-free Solder Materials. - Lausanne : EPFL, 2005 ; EPFL ; COST Action 531 Lead-free Solder Materials Language eng - English Country FR - France Document kind rozpis článkov z periodík (rzb) Citations DRAPALA, J. - KOZELKOVA, R. - BURKOVIC, R. - SMETANA, B. - DUDEK, R. - LASEK, S. - URBANEK, J. - DUSEK, K. - HAJEK, M. New types of lead-free solders on the base of tin and their properties. In KOVOVE MATERIALY-METALLIC MATERIALS. ISSN 0023-432X, 2009, vol. 47, no. 5, p. 283-293. Category AFG - Abstracts of papers from foreign conferences Year 2005 
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rok vydania rok metriky IF IF Q (best) SJR SJR Q (best) 0
Number of the records: 1