Number of the records: 1  

2005 International Conference on Electronics Materials and Packaging

  1. Title2005 International Conference on Electronics Materials and Packaging : EMAP 2005
    Issue dataTokyo : Tokyo Inst. of Technology , 2005
    Languageeng - English
    CountryJP - Japan
    Document kindzborníky
    CategoryAAA - Scientific monographs published abroad
    Category of document (from 2022)V1 - Vedecký výstup publikačnej činnosti ako celok
    Type of documentmonografia
    Year2006
    References (1) Publication Activity of SAV - Articles
    book

    book


Number of the records: 1  

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