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Laser ablation: A supporting technique to micromachining of SiC

  1. TitleLaser ablation: A supporting technique to micromachining of SiC
    Author Vanko Gabriel 1981 SAVELEK - Elektrotechnický ústav SAV    ORCID
    Co-authors Zehetner J.

    Choleva P.

    Lalinský Tibor 1951 SAVELEK - Elektrotechnický ústav SAV

    Hudek Peter 1953- SAVINFO - Ústav informatiky SAV    SCOPUS    RID    ORCID

    Source document ASDAM 2012 : conference proceedings. P. 259-262. - Piscataway : IEEE, 2012 / Haščík Štefan 1956 ; Osvald Jozef 1953 ; International Conference on Advanced Semiconductor Devices and Microsystems ASDAM 2012
    Languageeng - English
    Document kindrozpis článkov z periodík (rzb)
    CitationsZHANG, Huanzhen - HUANG, Ting - XIAO, Rongshi. Nanosecond pulsed fiber laser ablation of SiCinfp/inf/Al composite materials. In Zhongguo Jiguang/Chinese Journal of Lasers. ISSN 02587025, 2017-01-10, 44, 1, pp.
    MARTYCHOWIEC, A. - KWIETNIEWSKI, N. - SOCHACKI, M. A review of SiC surface cleaning methods. In PRZEGLAD ELEKTROTECHNICZNY. ISSN 0033-2097, 2019, vol. 95, no. 10, p. 154-157.
    WANG, Hongjian - YANG, Tao - LIAO, Runqian - SONG, Chang. Research Progress on Laser Drilling of Silicon Carbide and Its Power Devices. In Bandaoti Guangdian/Semiconductor Optoelectronics. ISSN 10015868, 2021-08-01, 42, 4, pp. Dostupné na: https://doi.org/10.16818/j.issn1001-5868.2021.04.002.
    CategoryADMB - Scientific papers in foreign non-impacted journals registered in Web of Sciences or Scopus
    Category of document (from 2022)V3 - Vedecký výstup publikačnej činnosti z časopisu
    Type of documentčlánok
    Year2012
    Registered inSCOPUS
    DOI 10.1109/ASDAM.2012.6418518
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    2012
Number of the records: 1  

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