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The influence of silver content on structure and properties of Sn-Bi-Ag solder and Cu/solder/Cu joints
Title The influence of silver content on structure and properties of Sn-Bi-Ag solder and Cu/solder/Cu joints Author Šebo Pavol 1939- SAVMAMES - Ústav materiálov a mechaniky strojov SAV SCOPUS Co-authors Švec Peter 1955 SAVFYZIK - Fyzikálny ústav SAV ORCID Janičkovič Dušan 1957 SAVFYZIK - Fyzikálny ústav SAV Illeková Emília 1949 SAVFYZIK - Fyzikálny ústav SAV Zemánková Milina 1946- SAVMAMES - Ústav materiálov a mechaniky strojov SAV Švec Peter Jr. 1983 SAVFYZIK - Fyzikálny ústav SAV Co-authors Plevachuk Yu Sidorov V. Source document Materials Science and Engineering A - Structural Materials Properties Microstructure and Processing. Vol. 571 (2013), p. 184-192 Language eng - English Country CH - Switzerland Document kind rozpis článkov z periodík (rbx) Citations MYUNG, W.R. - KIM, Y. - JUNG, S.B. Mechanical property of the epoxy-contained Sn-58Bi solder with OSP surface finish. In JOURNAL OF ALLOYS AND COMPOUNDS. ISSN 0925-8388, DEC 5 2014, vol. 615, p. S411-S417. XU, Bingsheng - CHEN, Junwei - YUAN, Zhangfu - ZANG, Likun - ZHANG, Lina - WU, Yan. Spreading Dynamics and Interfacial Characteristics of Sn-3.0Ag-0.5Cu-xBi Melting on Cu Substrates. In MICROGRAVITY SCIENCE AND TECHNOLOGY. ISSN 0938-0108, 2016, vol. 28, no. 2, pp. 115-122. SILVA, Bismarck L. - GARCIA, Amauri - SPINELLI, Jose E. Cooling thermal parameters and microstructure features of directionally solidified ternary Sn-Bi-(Cu,Ag) solder alloys. In MATERIALS CHARACTERIZATION. ISSN 1044-5803, 2016, vol. 114, no., pp. 30-42. LIU, Yang - FU, Haifeng - ZHANG, Hao - SUN, Fenglian - WANG, Xuan - ZHANG, Guoqi. Microstructure, hardness, and shear behavior of the as-soldered SnBi-SAC composite solder pastes. In JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS. ISSN 0957-4522, 2017, vol. 28, no. 24, pp. 19113-19120. SATIZABAL, Luz Myrian - COSTA, Diego - HAINICK, Guilherme Ottamr - MOURA, Diego Rodrigo - BORTOLOZO, Ausdinir Danilo - OSORIO, Wislei Riuper. Microstructural and Hardness Evaluations of a Centrifuged Sn-22Pb Casting Alloy Compared with a Lead-Free SnAg Alloy. In METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE. ISSN 1073-5623, 2017, vol. 48A, no. 4, pp. 1880-1892. KANG, Jia-Hui - SHENG, Jia-Li - FU, Xian-Zhu - SUN, Rong - WONG, Ching-Ping. A low-melting-point alloy filled epoxy conductive adhesives as thermal interface materials. In 2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017, vol., no., pp. 831-834. YANG, Bin - CHEN, Jianming - WU, Shanjiang - LI, Mingmao - ZHANG, Jianbo. Study on Wetting Shearing Properties and Interface Compounds of Sn-58Bi-(0-3)Ga/Cu. In Cailiao Daobao/Materials Review. ISSN 1005023X, 2017-07-25, 31, 7, pp. QIU, Yu - HU, Xiaowu - LI, Yulong - JIANG, Xiongxin. Interfacial reaction between liquid-state Sn-xBi solder and Co substrate. In JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS. ISSN 0957-4522, 2018, vol. 29, no. 11, pp. 9155-9165. WANG, Z. - ZHANG, Q. K. - CHEN, Y. X. - SONG, Z. L. Influences of Ag and In alloying on Sn-Bi eutectic solder and SnBi/Cu solder joints. In JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS. ISSN 0957-4522, 2019, vol. 30, no. 20, pp. 18524-18538. WANG, Fengjiang - CHEN, Hong - HUANG, Ying - LIU, Luting - ZHANG, Zhijie. Recent progress on the development of Sn-Bi based low-temperature Pb-free solders. In JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS. ISSN 0957-4522, 2019, vol. 30, no. 4, pp. 3222-3243. XU, Kai-Kai - ZHANG, Liang - GAO, Li-Li - JIANG, Nan - ZHANG, Lei - ZHONG, Su-Juan. Review of microstructure and properties of low temperature lead-free solder in electronic packaging. In SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS. ISSN 1468-6996, 2020, vol. 21, no. 1, pp. 689-711. YANG, Xiaolin - XU, Bingsheng - HOU, Shan - LIU, Ren - ZHAO, Xuezhi. Study on the Spreading Characteristics of the Solder Sn-3.0Ag-0.5Cu on an Inverted V-shaped Substrate. In E3S Web of Conferences. ISSN 25550403, 2020-02-06, 145, pp. Dostupné na: https://doi.org/10.1051/e3sconf/202014502069. LIU, Lu - XUE, Songbai - NI, Ruiyang - ZHANG, Peng - WU, Jie. Study on the Reliability of Sn-Bi Composite Solder Pastes with Thermosetting Epoxy under Thermal Cycling and Humidity Treatment. In CRYSTALS, 2021, vol. 11, no. 7, 733. Dostupné na: https://doi.org/10.3390/cryst11070733. KANG, Hyejun - RAJENDRAN, Sri Harini - JUNG, Jae Pil. Low Melting Temperature Sn-Bi Solder: Effect of Alloying and Nanoparticle Addition on the Microstructural, Thermal, Interfacial Bonding, and Mechanical Characteristics. In METALS, 2021, vol. 11, no. 2, 364. Dostupné na: https://doi.org/10.3390/met11020364. KIM, Dongjin - NAGAO, Shijo - CHEN, Chuantong - WAKASUGI, Naoki - YAMAMOTO, Yasuyuki - SUETAKE, Aiji - TAKEMASA, Tetsu - SUGAHARA, Tohru - SUGANUMA, Katsuaki. Online Thermal Resistance and Reliability Characteristic Monitoring of Power Modules With Ag Sinter Joining and Pb, Pb-Free Solders During Power Cycling Test by SiC TEG Chip. In IEEE TRANSACTIONS ON POWER ELECTRONICS. ISSN 0885-8993, 2021, vol. 36, no. 5, pp. 4977-4990. Dostupné na: https://doi.org/10.1109/TPEL.2020.3031670. YANG, Jie - ZHANG, Qingke - SONG, Zhenlun. Influences of Ag and In Alloying on Microstructure and Mechanical Properties of Sn-58Bi Solder. In JOURNAL OF ELECTRONIC MATERIALS. ISSN 0361-5235, 2021, vol. 50, no. 1, pp. 283-290. Dostupné na: https://doi.org/10.1007/s11664-020-08595-9. SONG, R.W. - CHEN, W.Y. - WANG, Y.CH. - et al. Enhancing mechanical strength of full intermetallic microbump via grain refinement by Zn in thermocompression bonding. In MATERIALS CHEMISTRY AND PHYSICS, 2022, vol. 291, no. 12, art. no. 126781. CHEN, C.T. - KIM, D.J. - ZHAN, Z. - et al. Interface-Mechanical and Thermal Characteristics of Ag Sinter Joining on Bare DBA Substrate During Aging, Thermal Shock and 1200 W/cm(2) Power Cycling Tests. In IEEE TRANSACTIONS ON POWER ELECTRONICS, 2022, vol. 37, no. 6, pp. 6647-6659. Category ADCA - Scientific papers in foreign journals registered in Current Contents Connect with IF (impacted) Category of document (from 2022) V3 - Vedecký výstup publikačnej činnosti z časopisu Type of document článok Year 2013 Registered in WOS Registered in SCOPUS Registered in CCC DOI 10.1016/j.msea.2013.02.013 
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rok CC IF IF Q (best) JCR Av Jour IF Perc SJR SJR Q (best) CiteScore A rok vydania rok metriky IF IF Q (best) SJR SJR Q (best) 2013 2012 2.108 Q1 1.744 Q1
Number of the records: 1