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Wettability of selected lead-free solders for higher application temperatures
Title Wettability of selected lead-free solders for higher application temperatures Author Koleňák Roman Šebo Pavol 1939- SAVMAMES - Ústav materiálov a mechaniky strojov SAV SCOPUS Co-authors Kostolný Igor Source document Key Engineering Materials. Vol. 705 (2016), p. 190-195 Language eng - English Document kind rozpis článkov z periodík (rbx) Citations KYAW, Tin Tin - TUNTHAWIROON, Phacharaphon - KANLAYASIRI, Kannachai - YAMANAKA, Kenta - CHIBA, Akihiko. A study on wettability and formation of intermetallic phase between Co–Cr–Mo alloy and Sn-Solder used as a potential under bump metallization for flip-chip packages. In Intermetallics. ISSN 09669795, 2020-10-01, 125, pp. Dostupné na: https://doi.org/10.1016/j.intermet.2020.106875. Category ADMB - Scientific papers in foreign non-impacted journals registered in Web of Sciences or Scopus Category of document (from 2022) V3 - Vedecký výstup publikačnej činnosti z časopisu Type of document článok Year 2017 Registered in WOS Registered in SCOPUS DOI 10.4028/www.scientific.net/KEM.705.190 
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rok CC IF IF Q (best) JCR Av Jour IF Perc SJR SJR Q (best) CiteScore N rok vydania rok metriky IF IF Q (best) SJR SJR Q (best) 2016 2015 0.173 Q3
Number of the records: 1