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Pulse-pressure diffusion bonding of Ti-6Al-4 V alloy with nanostructured Cu-W multilayer film as interlayer
Title Pulse-pressure diffusion bonding of Ti-6Al-4 V alloy with nanostructured Cu-W multilayer film as interlayer Author Li Hong Hodúlová Erika 1978- SAVMAMES - Ústav materiálov a mechaniky strojov SAV Co-authors Li Bo-jin Xing Zeng-cheng Yi-peng Wang Lehmert Benjamin Li Zhuo-xin Tillmann Wolfgang Source document Welding in the World. Vol. 67, iss. 5 (2023), p. 1337-1345 Language eng - English Country DE - Germany Document kind rozpis článkov z periodík (rbx) Category ADMA - Scientific papers in foreign impacted journals registered in Web of Sciences or Scopus Category of document (from 2022) V3 - Vedecký výstup publikačnej činnosti z časopisu Type of document článok Year 2023 Registered in WOS Registered in SCOPUS DOI 10.1007/s40194-023-01492-9 
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rok vydania rok metriky IF IF Q (best) SJR SJR Q (best) 2023 2022 2.1 Q2 0.485 Q2
Number of the records: 1