Interfacial reactions and critical current density of Cu-sheathed Cu-doped MgB2 wire with Ti diffusion barrier

Number of the records: 1

Title	Interfacial reactions and critical current density of Cu-sheathed Cu-doped MgB2 wire with Ti diffusion barrier
Author	Srivastava N.
Co-authors	Mehrotra S.
	Búran Marek SAVELEK - Elektrotechnický ústav SAV ^ORCID
	Hušek Imrich 1958 SAVELEK - Elektrotechnický ústav SAV
	Sharma D.
	Kováč Pavol 1952 SAVELEK - Elektrotechnický ústav SAV ^ORCID
	Santra S.

Source document	Journal of Alloys and Compounds. Vol. 966 (2023), no. 171657
Language	eng - English
Country	CH - Switzerland
Document kind	rozpis článkov z periodík (rbx)
Category	ADCA - Scientific papers in foreign journals registered in Current Contents Connect with IF (impacted)
Category of document (from 2022)	V3 - Vedecký výstup publikačnej činnosti z časopisu
Type of document	článok
Year	2023
Registered in	WOS
Registered in	SCOPUS
Registered in	CCC
DOI	10.1016/j.jallcom.2023.171657

article

	File name	Access	Size	Downloaded	Type	License
	Interfacial reactions and critical current density of Cu-sheathed Cu-doped.pdf	Neprístupný/archív	10.1 MB	0	Publisher's version

rok	CC	IF	IF Q (best)	JCR Av Jour IF Perc	SJR	SJR Q (best)	CiteScore
	A

rok vydania	rok metriky	IF	IF Q (best)	SJR	SJR Q (best)
2023	2022	6.2	Q1	0.678	Q1

Number of the records: 1