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Composite heat sink material for superconducting tape in fault current limiter applications
Title Composite heat sink material for superconducting tape in fault current limiter applications Author Pekarčíková M. Co-authors Mišík J. Drienovský M. Krajčovič J. Vojenčiak Michal 1983 SAVELEK - Elektrotechnický ústav SAV Búran Marek SAVELEK - Elektrotechnický ústav SAV ORCID Mošať Marek SAVELEK - Elektrotechnický ústav SAV ORCID Húlan Tomáš Skarba M. Cuninková E. Gömöry Fedor 1952 SAVELEK - Elektrotechnický ústav SAV ORCID Source document Materials. Vol. 13 (2020), art. no. 1832 Language eng - English Document kind rozpis článkov z periodík (rbx) Citations MORA, M. - AMAVEDA, H. - PORTA-VELILLA, L. - DE LA FUENTE, G.F. - MARTINEZ, E. - ANGUREL, L.A. Improved Copper-Epoxy Adhesion by Laser Micro- and Nano-Structuring of Copper Surface for Thermal Applications. In POLYMERS. JUN 2021, vol. 13, no. 11. Category ADCA - Scientific papers in foreign journals registered in Current Contents Connect with IF (impacted) Category of document (from 2022) V3 - Vedecký výstup publikačnej činnosti z časopisu Type of document článok Year 2020 Registered in WOS Registered in SCOPUS Registered in CCC DOI 10.3390/ma13081832 article
File name Access Size Downloaded Type License Composite heat sink material for superconducting tape in fault.pdf available 24.2 MB 7 Publisher's version rok CC IF IF Q (best) JCR Av Jour IF Perc SJR SJR Q (best) CiteScore A rok vydania rok metriky IF IF Q (best) SJR SJR Q (best) 2020 2019 3.057 Q2 0.647 Q2
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