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Joints realized by sintering of pressureless Ag paste
Title Joints realized by sintering of pressureless Ag paste Author Pietriková A. Co-authors Girasek Tomáš Livovský Ľubomír Ďurišin Juraj Jr. Saksl Karel 1974 SAVMATVY - Ústav materiálového výskumu SAV SCOPUS ORCID Source document Circuit World. Vol. 45, no. 1 (2019), p. 2-8 Language eng - English Document kind rozpis článkov z periodík (rbx) Citations ZHANG, Weifeng - CHEN, Jian - DENG, Zhonghua - LIU, Zhuguang - HUANG, Qiufeng - GUO, Wang - HUANG, Jiquan. The pressureless sintering of micron silver paste for electrical connections. In JOURNAL OF ALLOYS AND COMPOUNDS. ISSN 0925-8388, 2019, vol. 795, no., pp. 163-167. VEHEC, Igor - LENGER, Tomas - KARDOS, Slavomir - LUKACS, Peter - GONTKOVIC, Kristian. Polymer Thick-film Piezoresistive Sensor Integrated into the PCB. In Proceedings of the International Spring Seminar on Electronics Technology, 2023-01-01, 2023-May, pp. ISSN 21612528. Dostupné na: https://doi.org/10.1109/ISSE57496.2023.10168379. Category ADCA - Scientific papers in foreign journals registered in Current Contents Connect with IF (impacted) Category of document (from 2022) V3 - Vedecký výstup publikačnej činnosti z časopisu Type of document článok Year 2019 Registered in WOS Registered in SCOPUS Registered in CCC DOI 10.1108/CW-11-2018-0078 
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rok CC IF IF Q (best) JCR Av Jour IF Perc SJR SJR Q (best) CiteScore A rok vydania rok metriky IF IF Q (best) SJR SJR Q (best) 2019 2018 1.042 Q4 0.258 Q2
Number of the records: 1