Numerical simulation of thermal stabilization used in HTS tapes for SCFCL application

Number of the records: 1

Title	Numerical simulation of thermal stabilization used in HTS tapes for SCFCL application
Author	Cuninková E.
Co-authors	Pekarčíková M.
	Mošať Marek SAVELEK - Elektrotechnický ústav SAV ^ORCID
	Skarba M.

Source document	IEEE Transactions on Applied Superconductivity. Vol. 32 (2022), no. 5600805
Language	eng - English
Country	US - United States of America
Document kind	rozpis článkov z periodík (rbx)
Category	ADCA - Scientific papers in foreign journals registered in Current Contents Connect with IF (impacted)
Category of document (from 2022)	V3 - Vedecký výstup publikačnej činnosti z časopisu
Type of document	článok
Year	2022
Registered in	WOS
Registered in	SCOPUS
Registered in	CCC
DOI	10.1109/TASC.2022.3148694

article

	File name	Access	Size	Downloaded	Type	License
	Numerical simulation of thermal stabilization used in HTS tapes for SCFCL application.pdf	Neprístupný/archív	2.6 MB	2	Publisher's version

rok	CC	IF	IF Q (best)	JCR Av Jour IF Perc	SJR	SJR Q (best)	CiteScore
	A

rok vydania	rok metriky	IF	IF Q (best)	SJR	SJR Q (best)
2022	2021	1.949	Q3	0.443	Q2

Number of the records: 1