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Effects of gate shaping and consequent process changes on AlGaN/GaN HEMT reliability

  1. TitleEffects of gate shaping and consequent process changes on AlGaN/GaN HEMT reliability
    Author Moereke J.
    Co-authors Ťapajna Milan 1977 SAVELEK - Elektrotechnický ústav SAV    ORCID

    Uren M.J.

    Pei Y.

    Mishra Umesh K.

    Kuball M.

    Source document Physica status solidi A. Applications and materials science. Vol. 209, (2013), p. 2646-2652
    Languageeng - English
    Document kindrozpis článkov z periodík (rbx)
    CitationsHAHN, H. - REUTERS, B. - GEIPEL, S. - SCHAUERTE, M. - BENKHELIFA, F. - AMBACHER, O. - KALISCH, H. - VESCAN, A. In JOURNAL OF APPLIED PHYSICS. MAR 14 2015, vol. 117, no. 10.
    HAHN, H. - BENKHELIFA, F. - AMBACHER, O. - BRUNNER, F. - NOCULAK, A. - KALISCH, H. - VESCAN, A. In IEEE TRANSACTIONS ON ELECTRON DEVICES. FEB 2015, vol. 62, no. 2, p. 538-545.
    BORDOLOI, Sushanta - RAY, Ashok - TRIVEDI, Gaurav. Simulation framework for GaN devices with special mention to reliability concern. In VLSI and Post-CMOS Electronics, 2019-01-01, pp. 63-83. Dostupné na: https://doi.org/10.1049/PBCS073G_ch4.
    BORDOLOI, S. - RAY, A. - TRIVEDI, G. Introspection Into Reliability Aspects in AlGaN/GaN HEMTs With Gate Geometry Modification. In IEEE ACCESS. ISSN 2169-3536, 2021, vol. 9, p. 99828-99841.
    CategoryADCA - Scientific papers in foreign journals registered in Current Contents Connect with IF (impacted)
    Category of document (from 2022)V3 - Vedecký výstup publikačnej činnosti z časopisu
    Type of documentčlánok
    Year2013
    Registered inWOS
    Registered inSCOPUS
    Registered inCCC
    DOI 10.1002/pssa.201228395
    article

    article

    rokCCIFIF Q (best)JCR Av Jour IF PercSJRSJR Q (best)CiteScore
    A
    rok vydaniarok metrikyIFIF Q (best)SJRSJR Q (best)
    201320121.469Q20.866Q1
Number of the records: 1  

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