Composite heat sink material for superconducting tape in fault current limiter applications

Number of the records: 1

Title	Composite heat sink material for superconducting tape in fault current limiter applications
Author	Pekarčíková M.
Co-authors	Mišík J.
	Drienovský M.
	Krajčovič J.
	Vojenčiak Michal 1983 SAVELEK - Elektrotechnický ústav SAV
	Búran Marek SAVELEK - Elektrotechnický ústav SAV ^ORCID
	Mošať Marek SAVELEK - Elektrotechnický ústav SAV ^ORCID
	Húlan Tomáš
	Skarba M.
	Cuninková E.
	Gömöry Fedor 1952 SAVELEK - Elektrotechnický ústav SAV ^ORCID

Source document	Materials. Vol. 13 (2020), art. no. 1832
Language	eng - English
Document kind	rozpis článkov z periodík (rbx)
Citations	MORA, M. - AMAVEDA, H. - PORTA-VELILLA, L. - DE LA FUENTE, G.F. - MARTINEZ, E. - ANGUREL, L.A. Improved Copper-Epoxy Adhesion by Laser Micro- and Nano-Structuring of Copper Surface for Thermal Applications. In POLYMERS. JUN 2021, vol. 13, no. 11.
Category	ADCA - Scientific papers in foreign journals registered in Current Contents Connect with IF (impacted)
Category of document (from 2022)	V3 - Vedecký výstup publikačnej činnosti z časopisu
Type of document	článok
Year	2020
Registered in	WOS
Registered in	SCOPUS
Registered in	CCC
DOI	10.3390/ma13081832

article

	File name	Access	Size	Downloaded	Type	License
	Composite heat sink material for superconducting tape in fault.pdf	available	24.2 MB	7	Publisher's version

rok	CC	IF	IF Q (best)	JCR Av Jour IF Perc	SJR	SJR Q (best)	CiteScore
	A

rok vydania	rok metriky	IF	IF Q (best)	SJR	SJR Q (best)
2020	2019	3.057	Q2	0.647	Q2

Number of the records: 1