- A BDEM for transient thermoelastic crack problems in functionally gra…
Number of the records: 1  

A BDEM for transient thermoelastic crack problems in functionally graded materials under thermal shock

  1. TitleA BDEM for transient thermoelastic crack problems in functionally graded materials under thermal shock
    Author Ekhlakov A.V.
    Co-authors Khay O.M.
    Zhang C.
    Sládek Ján SAVSTAV - Ústav stavebníctva a architektúry SAV
    Sládek Vladimír SAVSTAV - Ústav stavebníctva a architektúry SAV
    Source document Computational Materials Science. Vol. 57 (2012), p. 30-37
    CategoryADCA - Scientific papers in foreign journals registered in Current Contents Connect with IF (impacted)
    Category of document (from 2022)V3 - Vedecký výstup publikačnej činnosti z časopisu
    Type of documentčlánok
    Year2012
    DOI 10.1016/j.commatsci.2011.06.019
    article

    article

Number of the records: 1  

  This site uses cookies to make them easier to browse. Learn more about how we use cookies.