- A BDEM for transient thermoelastic crack problems in functionally gra…
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A BDEM for transient thermoelastic crack problems in functionally graded materials under thermal shock

  1. Author Ekhlakov A.V.
    Co-authors Khay O.M.
    Zhang C.
    Sládek Ján SAVSTAV - Ústav stavebníctva a architektúry SAV
    Sládek Vladimír SAVSTAV - Ústav stavebníctva a architektúry SAV
    Source document Computational Materials Science. Vol. 57 (2012), p. 30-37
    CategoryADCA - Scientific papers in foreign journals registered in Current Contents Connect with IF (impacted)
    Category of document (from 2022)V3 - Vedecký výstup publikačnej činnosti z časopisu
    Type of documentčlánok
    Year2012
    DOI 10.1016/j.commatsci.2011.06.019
    article

    article

Number of the records: 1  

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