1. A BDEM for transient thermoelastic crack problems in functionally graded materials under thermal shock
Title : A BDEM for transient thermoelastic crack problems in functionally graded materials under thermal shock
Author : \q12*sav_un_auth*1 0158271 \q \q1013 sav_un_auth*0158271 \d Ekhlakov A.V. \q
Co-authors : \q12*sav_un_auth*1 0158228 \q \q1013 sav_un_auth*0158228 \d Khay O.M. \q
: \q12*sav_un_auth*1 0011158 \q \q1013 sav_un_auth*0011158 \d Zhang C. \q
: \q12*sav_un_auth*1 0000567 \q \q1013 sav_un_auth*0000567 \d Sládek Ján \q SAVSTAV - Ústav stavebníctva a architektúry SAV
: \q12*sav_un_auth*1 0000568 \q \q1013 sav_un_auth*0000568 \d Sládek Vladimír \q SAVSTAV - Ústav stavebníctva a architektúry SAV
Source document : \q12**1 077554 \q Computational Materials Science. Vol. 57 (2012), p. 30-37
Category : ADCA - Scientific papers in foreign journals registered in Current Contents Connect with IF (impacted)
Category of document (from 2022) : V3 - Vedecký výstup publikačnej činnosti z časopisu
Type of document : článok
Year : 2012
DOI : 10.1016/j.commatsci.2011.06.019