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The application of secondary effects in high aspect ratio dry etching for the fabrication of MEMS

  1. TitleThe application of secondary effects in high aspect ratio dry etching for the fabrication of MEMS
    Author Volland B.
    Co-authors Heerlein H.

    Kostič Ivan 1955- SAVINFO - Ústav informatiky SAV    SCOPUS    RID    ORCID

    Rangelow I.W.

    Source document Microelectronic Engineering. Vol. 57-58 (2001), p. 641-650
    Languageeng - English
    Document kindrozpis článkov z periodík (rbx)
    CitationsDOCKER, PT - KINNELL, P - WARD, MCL. A dry single-step process for the manufacture of released MEMS structures. In JOURNAL OF MICROMECHANICS AND MICROENGINEERING. ISSN 0960-1317, 2003, vol. 13, no. 5, pp. 790-794.
    DALEIDEN, J - HILLMER, H. Multiple air-gap filters and constricted mesa lasers material processing meets the front of optical device technology. In APPLIED PHYSICS B-LASERS AND OPTICS. ISSN 0946-2171, 2003, vol. 76, no. 8, pp. 821-832.
    ZOU, H. Anisotropic Si deep beam etching with profile control using SF6/O-2 Plasma. In MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS. ISSN 0946-7076, 2004, vol. 10, no. 8-9, pp. 603-607.
    DOCKER, PT - KINNELL, PK - WARD, MCL. Development of the one-step DRIE dry process for unconstrained fabrication of released MEMS devices. In JOURNAL OF MICROMECHANICS AND MICROENGINEERING. ISSN 0960-1317, 2004, vol. 14, no. 7, pp. 941-944.
    ZHANG, CC - YANG, CS - DING, DF. Deep reactive ion etching of PMMA. In APPLIED SURFACE SCIENCE. ISSN 0169-4332, 2004, vol. 227, no. 1-4, pp. 139-143.
    CASSELL, AM - YE, Q - CRUDEN, BA - LI, J - SARRAZIN, PC - NG, HT - HAN, J - MEYYAPPAN, M. Combinatorial chips for optimizing the growth and integration of carbon nanofibre based devices. In NANOTECHNOLOGY. ISSN 0957-4484, 2004, vol. 15, no. 1, pp. 9-15.
    ZHANG, Cong Chun - YANG, Chun Sheng - DING, Gui Fu - MAO, Hai Ping - NI, Zhi Ping. Study on deep reactive ion etching of commercial polymethlmethacrylate film. In Shanghai Jiaotong Daxue Xuebao/Journal of Shanghai Jiaotong University. ISSN 10062467, 2004-10-01, 38, sUPPL. 2, pp. 118-121.
    SAADAOUI, M - PONS, P - PLANA, R - BARY, L - DUBREUIL, P - BOURRIER, D - VASILACHE, D - NECULOIU, D - MULLER, A. Dry followed by wet backside etching processes for micromachined endfire antennae. In JOURNAL OF MICROMECHANICS AND MICROENGINEERING. ISSN 0960-1317, 2005, vol. 15, no. 7, pp. S65-S71.
    DOCKER, P. T. - KINNELL, P. K. - WARD, M. C. The optimisation of a resonant gas sensor by using nano-textured surfaces. In 2005 NSTI Nanotechnology Conference and Trade Show NSTI Nanotech 2005 Technical Proceedings, 2005-12-01, pp. 479-482.
    COOPER, A. - DOCKER, P. T. - WARD, M. C. A novel method of fabricating optical gratings using the one step DRIE process on SOI wafers. In 2005 NSTI Nanotechnology Conference and Trade Show NSTI Nanotech 2005 Technical Proceedings, 2005-12-01, pp. 508-510.
    JANSEN, H. V. - DE BOER, M. J. - UNNIKRISHNAN, S. - LOUWERSE, M. C. - ELWENSPOEK, M. C. Black silicon method X: a review on high speed and selective plasma etching of silicon with profile control: an in-depth comparison between Bosch and cryostat DRIE processes as a roadmap to next generation equipment. In JOURNAL OF MICROMECHANICS AND MICROENGINEERING. ISSN 0960-1317, 2009, vol. 19, no. 3, pp.
    GILGUNN, Peter J. - ALFARO, J. Fernando - FEDDER, Gary K. Model for aspect ratio dependent etch modulated processing. In JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A. ISSN 0734-2101, 2010, vol. 28, no. 2, pp. 334-346.
    XIE, Jian Bing - YUAN, Wei Zheng - CHANG, Hong Long. Application of notching effect in one-step dry etch and release process for the fabrication of MEMS. In Nami Jishu yu Jingmi Gongcheng/Nanotechnology and Precision Engineering. ISSN 16726030, 2010-03-01, 8, 2, pp. 167-170.
    WU, Banqiu - KUMAR, Ajay - PAMARTHY, Sharma. High aspect ratio silicon etch: A review. In JOURNAL OF APPLIED PHYSICS. ISSN 0021-8979, 2010, vol. 108, no. 5, pp.
    RANGANATHAN, N. - MALAR, A. - LEE, D. Y. - PRASAD, K. - PEY, K. L. Development and characterization of tapered silicon etch process by topography modeling for TSV application. In Journal of Microelectronics and Electronic Packaging. ISSN 15514897, 2010-12-01, 7, 1, pp. 58-66.
    SHANG, Zhengguo - LI, Dongling - WANG, Shengqiang - LIU, Jianhua. Application of ICP deep trenches etching in the Fabrication of FBAR Devices. In MICRO-NANO TECHNOLOGY XIII. ISSN 1013-9826, 2012, vol. 503, no., pp. 293-297.
    XIE, Jianbing - HAO, Yongcun - CHANG, Honglong - YUAN, Weizheng. Single Mask Selective Release Process for Complex SOI MEMS Device. In MICRO-NANO TECHNOLOGY XIV, PTS 1-4. ISSN 1013-9826, 2013, vol. 562-565, no., pp. 1116-1121.
    YANG ZHENCHUAN - WEI YUMIN - MAO XU - YAN GUIZHEN. A single-mask dry-release process for fabrication of high aspect ratio SOI MEMS devices. In SCIENCE CHINA-TECHNOLOGICAL SCIENCES. ISSN 1674-7321, 2013, vol. 56, no. 2, pp. 387-391.
    HA, Joon-Geun - LEE, Seung-Ki - BAI, Seoung-Jai - KIM, Yong-Kweon - PARK, Jae-Hyoung. Conductive microtip electrode array with variable aspect ratio using combination process of reactive ion etching. In JOURNAL OF MICROMECHANICS AND MICROENGINEERING. ISSN 0960-1317, 2013, vol. 23, no. 11, pp.
    STOHR, Frederik - MICHAEL-LINDHARD, Jonas - HUBNER, Jorg - JENSEN, Flemming - SIMONS, Hugh - JAKOBSEN, Anders Clemen - POULSEN, Henning Friis - HANSEN, Ole. Sacrificial structures for deep reactive ion etching of high-aspect ratio kinoform silicon x-ray lenses. In JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B. ISSN 1071-1023, 2015, vol. 33, no. 6, pp.
    ZHU, Yicheng - WANG, Wenjuan - YU, Feilong - LIU, Qingquan - GUO, Zilu - LI, Guanhai - CHEN, Pingping - LU, Wei. The Impact of Manufacturing Imperfections on the Performance of Metalenses and a Manufacturing-Tolerant Design Method. In MICROMACHINES, 2022, vol. 13, no. 9, pp. Dostupné na: https://doi.org/10.3390/mi13091531.
    ZHU, Y.C. - WANG, W.J. - ZHOU, M. - QU, H.D. - LI, G.H. - CHEN, P.P. - LU, W. The study and optimization of ICP deep etching at a low-temperature for InP solid-immersion metalens fabrication. In MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING. ISSN 1369-8001, NOV 1 2023, vol. 166. Dostupné na: https://doi.org/10.1016/j.mssp.2023.107700.
    HU, W.H. - WANG, Z.H. - PAN, A.X. - CUI, B. High aspect ratio silicon ring-shape micropillars fabricated by deep reactive ion etching with sacrificial structures. In MICRO AND NANO ENGINEERING. MAR 2024, vol. 22. Dostupné na: https://doi.org/10.1016/j.mne.2023.100234.
    CategoryADC
    Year2001
    Registered inWOS
    Registered inSCOPUS
    Registered inCCC
    článok

    článok

    rokCCIFIF Q (best)JCR Av Jour IF PercSJRSJR Q (best)CiteScore
    A
    rok vydaniarok metrikyIFIF Q (best)SJRSJR Q (best)
    2001
Počet záznamov: 1  

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