Počet záznamov: 1
Interface between Sn-Sb-Cu solder and copper substrate
Názov Interface between Sn-Sb-Cu solder and copper substrate Autor Šebo Pavol 1939- SAVMAMES - Ústav materiálov a mechaniky strojov SAV SCOPUS Spoluautori Švec Peter 1955 SAVFYZIK - Fyzikálny ústav SAV ORCID Janičkovič Dušan 1957 SAVFYZIK - Fyzikálny ústav SAV Illeková Emília 1949 SAVFYZIK - Fyzikálny ústav SAV Spoluautori Plevachuk Yu. Zdroj.dok. Materials Science and Engineering A. Vol. 528, no. 18 (2011), p. 5955-5960 Jazyk dok. eng - angličtina Druh dok. rozpis článkov z periodík (rbx) Ohlasy KOBAYASHI, Y. - SHIROCHI, T. - YASUDA, Y. - MORITA, T. Metal-metal bonding process using metallic copper nanoparticles prepared in aqueous solution. In INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES. ISSN 0143-7496, MAR 2012, vol. 33, p. 50-55. SHEN, Jun - PU, Yayun - WU, Dong - TANG, Qin - ZHAO, Mali. Effects of minor Bi, Ni on the wetting properties, microstructures, and shear properties of Sn-0.7Cu lead-free solder joints. In JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS. ISSN 0957-4522, 2015, vol. 26, no. 3, pp. 1572. DAI, J. H. - SHI, B. - HU, Z. Z. - QUAN, H. Y. - SONG, Y. Influence of alloying elements on stability and electronic structures of Cu6Sn5(010) surface by first principles calculations. In COMPUTATIONAL MATERIALS SCIENCE. ISSN 0927-0256, 2017, vol. 127, no., pp. 230-235. YUAN, Ye - CHEN, Xiumin - ZHOU, Zhiqiang - LI, Yifu - XU, Baoqiang - LIU, Dachun - YANG, Bin. Theoretical study on Sn-Sb-based lead-free solder by ab initio molecular dynamics simulation. In JOURNAL OF MATERIALS RESEARCH. ISSN 0884-2914, 2019, vol. 34, no. 14, pp. 2543-2553. KOBAYASHI, Tatsuya - MITSUI, Kohei - SHOHJI, Ikuo. Effects of Ni Addition to Sn-5Sb High-Temperature Lead-Free Solder on Its Microstructure and Mechanical Properties. In MATERIALS TRANSACTIONS. ISSN 1345-9678, 2019, vol. 60, no. 6, pp. 888-894. EID, E. A. - DEGHADY, A. M. - FOUDA, A. N. Enhanced microstructural, thermal and tensile characteristics of heat treated Sn-5.0Sb-0.3Cu (SSC-503) Pb-free solder alloy under high pressure. In MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING. ISSN 0921-5093, 2019, vol. 743, pp. 726-732. BI, Xiaoyang - HU, Xiaowu - LI, Yulong - JIANG, Xiongxin. Effect of Bi on microstructure and mechanical properties of Sn-10Sb-1.5Cu (SSC1015) solder alloys. In MATERIALS RESEARCH EXPRESS. ISSN 2053-1591, 2019, vol. 6, no. 2, 026565. ARAINA, Aneta - KOSCIELSKI, Marek - SITEK, Anna - STEPLEWSKI, Wojciech - JANECZEK, Kamil - LIPIEC, Krzysztof - RAFALIK, Ireneusz - SITEK, Janusz. Comparison of SAC and new Pb-free solder alloy for special application. In 2020 IEEE 8TH ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC), 2020, 225079167. HAN, Y. D. - GAO, Y. - JING, H. Y. - WEI, J. - ZHAO, L. - XU, L. Y. A modified constitutive model of Ag nanoparticle-modified graphene/Sn-Ag-Cu/Cu solder joints. In MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING. ISSN 0921-5093, 2020, vol. 777, 139080. CHANTARAMANEE, Suchart - SUNGKHAPHAITOON, Phairote. Investigation of microstructure, thermal properties, and mechanical performances of Ni-added Sn-5.0Sb-0.5Cu/Cu solder joints. In MICROELECTRONICS RELIABILITY. ISSN 0026-2714, 2021, vol. 127, 114421. Dostupné na: https://doi.org/10.1016/j.microrel.2021.114421. CHEN, D.D. - QIN, J.H. - ZHANG, X. - et al. Aging Interfacial Structure and Abnormal Tensile Strength of SnAg3Cu0.5/Cu Solder Joints. In MATERIALS, 2022, vol. 15, no. 24, art. no. 9004. YI, H.T. - DONG, B.W. - WU, Z. - et al. CALPHAD-guided optimization of the microstructure of Sn-Sb-Cu bearing alloys. In MATERIALS CHEMISTRY AND PHYSICS, 2022, vol. 290, no. 12, art. no. 126627. POOSHGAN, Hoda - NAFFAKH-MOOSAVY, Homam. The effect of Ge on the microstructure, thermal behavior, and mechanical properties of lead-free Sn5Sb-0.7Cu solder alloy. In JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2023, vol. 34, no. 1, pp. ISSN 0957-4522. Dostupné na: https://doi.org/10.1007/s10854-022-09496-9. SUKHONTAPATIPAK, Panisara - SUNGKHAPHAITOON, Phairote. Improvements in the properties of low-Ag SAC105 solder alloys with the addition of tellurium. In JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2023, vol. 34, no. 17, pp. ISSN 0957-4522. Dostupné na: https://doi.org/10.1007/s10854-023-10704-3. Kategória ADCA - Vedecké práce v zahraničných karentovaných časopisoch impaktovaných Kategória (od 2022) V3 - Vedecký výstup publikačnej činnosti z časopisu Typ výstupu článok Rok vykazovania 2011 Registrované v WOS Registrované v SCOPUS Registrované v CCC DOI 10.1016/j.msea.2011.04.008 
článok
rok CC IF IF Q (best) JCR Av Jour IF Perc SJR SJR Q (best) CiteScore A rok vydania rok metriky IF IF Q (best) SJR SJR Q (best) 2011 2010 2.101 Q1 1.723 Q1
Počet záznamov: 1